SV Two Component 1:1 electronic potting compound Sealant
Product Description
FEATURES
1. Low viscosity, good fluidity, fast bubble dissipation.
2. Excellent electric insulation and heat conduction.
3. It can be deeply potting without the generation of low molecular substances during the curing, has extremely low shrinkage and excellent adhesion to components.
PACKAGING
A:B =1:1
A part: 25 KG
B part: 25 KG
BASIC USES
1. Potting and waterproof for LED driver, ballasts, and reverse parking sensors.
2. Insulation, thermal conduction, moisture-proofing, and fixation functions for other electronic components
TYPICAL PROPERTIES
These values are not intended for use in preparing specifications
| PROPERTY | A | B | |
| Before Mixture | Appearance | White | Black |
| (25℃,65%RH) | Viscosity | 2500±500 | 2500±500 |
| Density (25℃, g/cm³) | 1.6±0.05 | 1.6±0.05 | |
| After Mixtured | Proportion Ratio (By Weight) | 1 | 1 |
| (25℃,65%RH) | Color | Grey | |
| Viscosity | 2500~3500 | ||
| Operation Time (min) | 40~60 | ||
| Curing Time (H, 25℃) | 3~4 | ||
| Curing Time (H, 80℃) | 10~15 | ||
| After Curing | Hardness (Shore A) | 55±5 | |
| (25℃,65%RH) | Tensile Strength (Mpa) | ≥1.0 | |
| Thermal Conductivity (W/m·k) | ≥0.6~0.8 | ||
| Dielectric Strength (KV/mm) | ≥14 | ||
| Dielectric Constant (1.2MHz) | 2.8~3.3 | ||
| Volume Resistivity (Ω·cm) | ≥1.0×1015 | ||
| Coefficient Of Linear Expansion (m/m·k) | ≤2.2×10-4 | ||
| Working Temperature (℃) | -40~100 | ||
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